IPC-7095E-2024 EN Design and Assembly Process Guidance for Ball Grid Arrays (BGAs).pdf
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IPC-7095E BGA Design and Assembly Process Implementation
Industry：
Fabricator/Manufacturer
2. EMS/Assembly/Contract Manufacturer/ODM
/Consulting company/Semiconductor Packaging
IPC-7095E describes the design and implementation of assembly processes for Ball Grid Array (BGA) and Fine Pitch Ball Grid Array (FBGA) technologies, with an emphasis on inspection, maintenance, and reliability issues for designs and printed circuit board assemblies using these packages. Many of these issues have become particularly important due to changes in the alloy in the solder balls, the shape of the solder balls, the encapsulation procedure, etc., and IPC-7095E provides practical information for those who use or are considering the use of BGAs.IPC-7095E describes how to use BGAs to successfully implement a robust design and assembly process for printed circuit board assemblies, and how to troubleshoot some of the common anomalies, and provides information on some of the new mechanical failure issues such as pit cracks or lamination defects that occur after assembly. In addition to providing guidelines for BGA inspection and repair, this standard also addresses reliability issues associated with BGAs and standards for the use of lead-free solder joints. The standard has many X-ray and endoscopic photographs and illustrations to identify some of the conditions encountered in the implementation of the BGA assembly process in the industry.Version E is due for release in October 2024.The standard has been developed to meet the needs of the industry.
